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Page statistics. IMECAT Publications Petar Ratchev, Bart Vandevelde and Ingrid De Wolf : “Reliability and Failure Analysis of Sn-Ag-Cu Solder Interconnections ...
EFUG2002 -Bellaria 7/10/02 ©IMEC Orientation Imaging Microscopy (OIM) Applications in Cu-Interconnects and Cu-Cu Wire Bonding Petar Ratchev, Laureen Carbonell, Hong MengHo, Hugo Bender ...
6 feb 2004 Confidential *imec IMEC goes Lead-free Bart Vandevelde Petar Ratchev Riet Labie Jan Vanfleteren (Intec/Elis) Mario Gonzalez IMEC seminar 6 Febr. 2004 Pb Pb
Aleksandar Davidkov, Roumen Petrov, Vitaliy Bliznuk, Petar Ratchev, Peter de Smet, Bruno Schepers, Leo Kestens: Microstructure and Hemming Properties of AA6016 Aluminum Alloy Sheets
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Aleris (Privately Held; Mining & Metals industry): Manager Basic Knowledge, (S...