Nicolas Lietaer

Nicolas Lietaer, SINTEF ICT 216thECS meeting, Vienna Oct4-9, 2009 8 3D integration of MEMS/NEMS and IC  Specific challenges for MEMS and NEMS  Substrate thickness (300 to 1000 µm) ...

Nicolas Lietaer: 2009 - 2012: ARTEMIS Call 1 Cost-efficient methods and processes for safety relevant embedded systems - CESAR ARTEMIS Call 1 Cost-efficient methods and processes for ...

Norway - Pictures by Nicolas Lietaer Norway - Photo blog by Thomas Laupstad Norway - Pictures by Klaus Meyer Norway - Pictures and random information by Sverre

... signal processing time [22]. 3D DETECTOR ACTIVITIES AT SINTEF MINALAB - WAFER BONDING AND DEEP REACTIVE ION ETCHING Angela Kok*, Thor-Erik Hansen, Trond Hansen, Nicolas Lietaer, Michal ...

Head of lab equipment maintenance Special qualifications Can fix broken, old stuff Responsibilities Diffusion furnaces Gas supplies, pumps Cub chief Nicolas Lietaer nicolas.lietaer@sintef ...